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February 11, 2012, 4:36 am
 
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High Temperature Alloys

Microstructural analysis: Light Microscopy, Scanning Electron Microscopy (SEM) with quantitative microanalysis (EDS, WDS) and Automatic Image Analyser (AIA), Orientation Image Microscopy (EBSD), Transmission Electron Microscopy with scanning equipment (TEM/STEM) and EDS+AIA-assisted, X-ray diffraction (at room and high temperature, up to 1450°C),
Surface analysis and scale investigation by Electron Spectroscopy Chemical Analysis (ESCA-XPS) and Glow Discharge Optical Emission Spectroscopy (GDOES) techniques,
Creep testing: from 400°C up to 1150°C with continuous strain measurements, Creep Crack Growth (CCG), facilities for creep test in vacuum and inert gases (Ar, Ne), development of novel creep procedures and techniques for special purposes and for model fitting and fine tuning,
Creep data assessment using ECCC (European Creep Collaborative Committee) procedures,
Creep strain model by coupled metallurgical-micromechanical in-house (made) models, fitted by conventional and non conventional in-house (made) experimental techniques,
Evaluation of thermal expansion coefficient vs. temperature by dilatometer, Tsolidus/liquidus by Differential Temperature Analysis (DTA) technique, Thermal Diffusivity,
Microstructural / evolution as a function of temperature/time/strain,
Residual life assessment,
Corrosion and oxidation (e.g. including steam and high temperature oxidation),
Tribological characterisation of materials and components, by thermal fatigue, rolling contact fatigue, friction and adhesion, wear (at room and high temperature up to 1200°C),

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